thursday, April 22nd 2010

Embedded Modules

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EDITO Top M2M & WIRELESS
Intelligent HSDPA Wireless Router Logo
 
 

MultiModem® rCell
The MultiModem® rCell intelligent wireless router offers standards-based tri-band HSDPA performance via the integrated cellular modem. This ready-to-deploy, standalone router provides shared Internet access and integrates seamlessly with virtually any application. The intelligent embedded operating system allows for automatic/persistent connectivity for mission-critical applications and enhanced M2M functionality. It includes 10/100BaseT Ethernet and RS-232 serial connectivity.

 
EDGE and HSDPA connectivity in standard LGA form factor Logo
 
 

The new product line offers EDGE and HSDPA connectivity in a compact and lightweight form factor based on standard 25x30 mm LGA (Land Grid Array). It offers an easy upgrade path to new network technologies and enables fully automated surface-mount manufacturing.

 
Industry's first 'foolproof' programmable ZigBee module Logo
 
 

Isolated wireless software speeds ZigBee development.
The XBee-PRO ZB from Digi International is the industry's first foolproof programmable ZigBee module for easy and safe ZigBee application development. Customer applications can be programmed directly on the module, eliminating the need and cost of a separate processor and reducing time-to-market. Because the Digi-provided wireless software is isolated, customers can easily develop applications with no risk to RF performance and security. As part of iDigi, customers can also use the iDigi platform to easily integrate XBee ZigBee endpoints into their systems.

XBee® & XBee-PRO® ZB ZigBee® PRO RF Modules

Get Started for USD 299,00 ex VAT

 
STM 300 for energy harvesting wireless sensors Logo
 
 

STM 300 features an energy harvesting interface for the implementation of self-powered products. The minimal standby power consumption makes it especially suitable for energy harvesting wireless solutions such as bidirectional temperature sensors, sensors in building services and innovative actuators. STM 300 can be powered by a solar cell, available in two sizes - ECS 300 and ECS 310.


Bidirectional Dolphin Modules STM 300, TCM 300 and TCM 320 mean new possibilities in automation.
Datasheets :  STM300  -  ECS300/310 (Solar Cells)  -  EDK300 (Developers Kit)

 
Top SEMI CONDUCTORS
TQMPxxxx, the QorIQ™ Module - the next generation in professional communication Logo
 
 

The embedded module TQMPxxxx from TQ-Components is the next generation of the well established PowerQUICC III module familiy TQM85xx. Freescale’s QorIQ™ processor family P1 and P2 open up new performance capabilities in the world of communication.

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ITX, Nano-ITX and Pico-ITX Mainboards Logo
 
 

VIA EPIA-T700 Mobile-ITX Board : The smallest x86 computer-on-module


The VIA EPIA-T700 is the first product based on the Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.

 

VIA EPIA-P820 Pico-ITX Board : Palm-sized, powerful Pico-ITX performance


Based on the VIA Nano processor, the VIA EPIA-P820 offers customers a range of advantages over competitor offerings, including full 64-bit software support, a high-performance superscalar architecture and full support of the latest virtualization technologies for next generation server and virtual machine applications.

 

VIA EPIA-M800 : Combines the VIA Nano processor with VIA VX800 MSP for smooth HD video playback on dual displays


The VIA EPIA-M800 is the first EPIA Mini-ITX board to combine both the VIA Nano processor and the all-in-one VIA VX800 digital media IGP chipset.
 
ADLINK Embedded Computing new products Logo
 
 

  • Express-CB : COM Express™ Module with Intel® Core™ i7/i5 Processor and QM57 Chipset
  • CPCI-6510 : 6U CompactPCI® Intel® Core™ i7 universal Blade with two PMC sites
  • NuPRO-E330 : PICMG® 1.3 Full-Size Intel® Core™ i7/i5/i3 LGA1156 SHB
  • NanoX-Ml : COM Express™ Type 1 Pinout Compatible module with Intel® Atom™ Z5xx Processor and US15W Chipset
  • ATCA-6100 : Dual Quad-Core Intel® Xeon L5518 AdvancedTCA® Processor Blade with 10GbE fabric Interface.
 
3.5-Inch Embedded Board, ECM-PNV Featuring the New Dual Core Intel® Atom™ Processor D510 Logo
 
 

Avalue released a new 3.5-inch single board computer, ECM-PNV which is powered by the Intel® Atom™ processor D510 and Intel® 82801HM I/O Controller. Based on 45nm process technology, the new Intel® Atom™ processor D510 is part of the next generation of Intel® Atom™ processors, bringing the memory controllers and graphics cores on the same die
as the CPU. This new two-chip solution will provide system builders with supports for slimmer housing designs. Datasheet: ECM-PNV

 
Top SEMI CONDUCTORS
Leading edge technology configurable 600 watt power supplies Logo
 
 

The Vox products are leading edge technology configurable 600 watt power supplies. The product itself is 3 x 5 inches in size and can deliver 600 watts with up to 4 separate isolated outputs, each output module can deliver a maximum of 150 watts.
The Nevo products are made up of 4 different front end AC sections i.e. Nevo600S(Standard – EN60950 Approvals), Nevo600M (Medical – EN60601 Approvals), Nevo+600S (Standard with higher power specification at low I/P AC levels), Nev0+600M (Medical with higher power specification at low i/p AC levels. There are presently 4 O/P modules available which slot into the front ends i.e.5V, 12V,24V & 48V. Each O/P module has a voltage trim range which allows the customer trim the voltage to any level from 1V5 to 58V.

Datasheets :

 
CF Grade Isolated DC/DC Converters Logo
 
 

Designed to provide isolated dc power for applications requiring CF Body Contact and Defibrillation Proof

The CFQor series of Quarter-Brick DC-DC converters are high efficiency converters designed for those medical applications that require isolation and leakage current levels that comply with IEC60601-1 for CF patient contact and are also defibrillation proof.

 
Top ALCOM ELECTRONICS
 

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